realme GT NEO 3 powered by Mediatek Dimensity 8100
The realme GT NEO 3 is powered by the MediaTek Dimensity 8100 5G chip. It boasts the industry’s first 150W ‘UltraDart’ fast charging for its 4,500mAh battery.
With unparalleled power-efficiency, this 5nm-class chip includes 2.85GHz octa-core CPU with 4X Arm-Cortex A78 processors, plus a new Arm Mali-G610 graphics engine, and MediaTek’s latest 5th generation APU (AI processor) that can assist a wide range of tasks. realme pairs the advanced chip with up to 12GB of super-fast LPDDR5 memory and 256GB of internal storage. The Dimensity 8100 empowers the GT NEO 3 with the latest R16-standard 5G modem, new Bluetooth 5.3 and Wi-Fi 6E connectivity.
Encased in its ‘Diamond Ice Core Cooling Plus’, it’s total heat dissipation area encompasses nearly 400 square cm of area, while inside over 41 square cm of 3D tempered vapor chamber (VC) cooling together provides efficient and effective thermal management.
The GT NEO 3 features triple cameras at the back: a 50MP Sony IMX766 primary sensor with OIS, plus a 119º ultrawide lens, and a macro sensor. At the front is a 16MP camera for selfies and video calls.
Multimedia credentials include Dolby Atmos audio, and a large 6.7-inch 2K display with HDR10+, DC dimming support and a fast 120Hz refresh rate. The display includes a gamer-friendly 1,000Hz touch sampling rate, so it never misses a click! Furthermore, for game enthusiasts, the realme GT NEO 3 includes ‘4D Game Vibration’ via X-axis linear motor.
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